JPH0457174B2 - - Google Patents
Info
- Publication number
- JPH0457174B2 JPH0457174B2 JP19107985A JP19107985A JPH0457174B2 JP H0457174 B2 JPH0457174 B2 JP H0457174B2 JP 19107985 A JP19107985 A JP 19107985A JP 19107985 A JP19107985 A JP 19107985A JP H0457174 B2 JPH0457174 B2 JP H0457174B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- molds
- press
- bolsters
- fixing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
- B29C45/2606—Guiding or centering means
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19107985A JPS6251413A (ja) | 1985-08-30 | 1985-08-30 | トランスファモ−ルドプレス |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19107985A JPS6251413A (ja) | 1985-08-30 | 1985-08-30 | トランスファモ−ルドプレス |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6251413A JPS6251413A (ja) | 1987-03-06 |
JPH0457174B2 true JPH0457174B2 (en]) | 1992-09-10 |
Family
ID=16268512
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19107985A Granted JPS6251413A (ja) | 1985-08-30 | 1985-08-30 | トランスファモ−ルドプレス |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6251413A (en]) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2640238B2 (ja) * | 1988-02-04 | 1997-08-13 | トーワ株式会社 | 半導体素子の樹脂封止成形用金型装置 |
JPH0694135B2 (ja) * | 1989-02-03 | 1994-11-24 | 三菱電機株式会社 | 樹脂封止装置 |
JP3152601B2 (ja) * | 1995-11-17 | 2001-04-03 | 株式会社精工技研 | ディスク射出成形金型の固定側と可動側の円盤キャビティプレートの整列案内装置 |
-
1985
- 1985-08-30 JP JP19107985A patent/JPS6251413A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6251413A (ja) | 1987-03-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |